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| SPECIFICATION FOR APPROVAL REF : PROD. NAME ABC'S DWG NO. PAGE: 1 MULTILAYER CHIP BEAD ABC'S ITEM NO. MU1005L- CONFIGURATION & DIMENSIONS A D D C B I G PCB Pattern I Unit : m/m Series MU1005 A 1.000.10 B 0.500.10 C 0.500.10 D 0.200.10 G 0.4 H 0.4 H I 0.5 SCHEMATIC DIAGRAM MATERIALS aBodyFerrite bInternal conductorSilver or Ag / Pd cTerminal electrodeAg/Ni/Sn dRemarkProducts comply with RoHS' requirements a b c GENERAL SPECIFICATION aStorage temp.-40 ---- +105 bOperating temp.-55 ---- +125 cTerminal strength F Type MU1005 dSolderability Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent Solder temp. : 2605 Flux : Rosin Dip time : 41 seconds AR-001A F ( kgf ) 0.3 Time ( sec ) 305 Temperature ( ) 250 50s ec max. Peak Temp260 max. M ax tim e above 230 50sec max. M ax tim e above 200 70sec max. Temperature Rising Area +4.0 / sec max. Preheat Area 150 ~ 200 / 60 ~ 120sec Reflow Area +2.0 ~ 4.0 / sec max. Forced Cooling Area -(1.0 ~ 5.0) / sec max. P eak Temperature: 260 230 200 150 70sec max. 100 50 0 50 100 150 Tim e ( seconds ) 200 250 SPECIFICATION FOR APPROVAL REF : PROD. NAME PAGE: 2 MULTILAYER CHIP BEAD ABC'S DWG NO. ABC'S ITEM NO. MU1005L- ELECTRICAL CHARACTERISITCS DWG No. MU1005300YL- MU1005600YL- MU1005121YL- MU1005221YL- MU1005301YL- MU1005451YL- MU1005601YL- Impedance () At 100MHz 30.025 % 60.025 % 120.025 % 220.025 % 300.025 % 450.025 % 600.025 % DC Resistance () max 0.30 0.40 0.50 0.70 0.80 0.90 1.00 Rated Current ( mA ) max 500 200 200 100 100 100 100 1). Packaging Information... ABulk BTaping Reel 2)."- ":Reference code AR-001A SPECIFICATION FOR APPROVAL REF : PROD. NAME PAGE: 3 MULTILAYER CHIP BEAD ABC'S DWG NO. ABC'S ITEM NO. MU1005L- IMPEDANCE VS. FREQUENCY RESPONSE CURVE 10 3 MU1005300Y 10 3 MU1005600Y Z X R 10 2 10 2 Imoedanc e ( ) Impedanc e ( ) Z X 10 1 10 1 R 10 0 10 0 101 10 2 10 3 10 0 10 0 101 102 10 3 Frequency ( MHz ) 10 3 Frequency ( MHz ) 10 3 MU1005121Y MU1005221Y Z Z 10 2 10 2 Impedanc e ( ) Impedanc e ( ) X X R 10 1 10 1 R 10 0 10 0 101 102 10 3 10 0 10 0 101 102 10 3 Frequency ( MHz ) 10 3 Frequency ( MHz ) 10 3 MU1005301Y Z MU1005451Y Z 10 2 10 2 Impedanc e ( ) R Impedanc e ( ) X X R 10 1 10 1 10 0 10 0 101 2 10 10 3 10 0 10 0 1 10 2 10 10 3 Frequency ( MHz ) 10 3 Frequency ( MHz ) MU1005601Y Z 10 2 Impedanc e ( ) X R 10 1 10 0 10 0 101 10 2 10 3 Frequency ( MHz ) AR-001A SPECIFICATION FOR APPROVAL REF : PROD. NAME PAGE: 4 MULTILAYER CHIP BEAD ABC'S DWG NO. ABC'S ITEM NO. MU1005L- PACKAGING INFORMATION ( 1 ) Configuration T Cover Tape 2.00.5 A B C C N G D Emobossed Carrier Carrier tape width : D P:2 m/m End 4 m/m Start Leader no component 200 m/m min. Components User direction of feed Trailer no component 400 m/m min. ( 2 ) Dimensions Style 07 - 08 A 178 B 210.8 C 13 D 8 G 10 +0 N 50 -0 Unit:m/m T 12.5 ( 3 ) Q'TY & G.W. Per package Series Q'TY (pcs) Inner : Reel G.W. (gw) Style Q'TY(kpcs) Outer : Carton G.W. (Kg) Size (cm) MU1005 10,000 60 07 - 08 500 5.5 42 x 41 x 24 AR-001A SPECIFICATION FOR APPROVAL REF : PROD. NAME PAGE: 5 MULTILAYER CHIP BEAD ( 4 ) TYPE DIMENSIONS 1.750.1 (0.0690.004) ABC'S DWG NO. ABC'S ITEM NO. MU1005L- Fig 1. 1.550.05 20.05 40.1 (0.1570.004) (0.0790.002) (0.0610.002) T max. F0.05 (0.002) P0.1 (0.004) A0.1 (0.004) B0.1(0.004) W0.2 (0.008) Unit:m/m Type MU1005 A 0.65 B 1.15 F 3.50 P 2.0 T 0.80 W 8.0 Fig 1 AR-001A SPECIFICATION FOR APPROVAL REF : PROD. NAME PAGE: 6 MULTILAYER CHIP BEAD ABC'S DWG NO. ABC'S ITEM NO. MU1005L- DWGING NUMBER EXPRESSION MU 1 0 0 5 Reference code Appendix code 2 : Package Appendix code 1 : Classification Tolerance code Electrical code Dimension code Type code Appendix code 1Product Classification LLead Free Standard products comply with RoHS' requirements 1 ~ 9Lead Free Special products comply with RoHS' requirements Appendix code 2Package Information Code A B Inner package T.B.D. T / R ( Reel package ) Inner package Q'TY T.B.D. 10000 pcs Remark AR-001A |
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